The miniaturization of a LiDAR system to fit within the palm of a hand involved significantly reducing the number of components. This not only makes the device more compact but also simplifies the assembly process, enabling small series production at lower costs. The compact design does not compromise performance; instead, it ensures that high-resolution and high-accuracy data can be collected efficiently. In the presentation we will focus on describing the steps of the assembly process from the Photonic Integrated Circuit (PIC) design (at the core of the solution) to its integration to a home designed ASIC via flip chip and its wire bonding to a PCB using fine pitch technologies as well as all the housing considerations.